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5630 Epistar Led Light PCB Board Assembly

5630 Epistar Led Light PCB Board Assembly
5630 Epistar Led Light PCB Board Assembly, we provide customers with whole-process services from material sourcing, patch, insert, welding, assembly, testing, inspection, packaging to shipping.
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What are the quality standards for SMT processing?What aspects should be tested when accepting SMT products?

Inspection environment, inspection equipment, inspection items
1. Tin beads:
The solder ball shall not exceed the minimum electrical clearance requirements;
The solder ball is covered with conformal coating or not fixed in the residue free of cleaning;
If solder ball diameter less than 0.13mm can be accepted, otherwise rejected.

2. False welding:
The overlap between the solder end and the pad is clearly visible.(acceptable)
Insufficient overlap between the end of the element and the pad.(rejected)
3. Side stand:
The ratio of width(W) to height(H) shall not exceed 2:1;(acceptable)
The ratio of width(W) to height(H) is more than 2:1;(rejected)
The solder end and the pad surface are not fully wet,components are greater than 1206.(rejected)
4. Flat, L shape and wing pin excursion:
The minimum large side offset(A) is not greater than 50% or 0.5mm of the pin width(W);(acceptable)
The minimum large side offset(A) is greater than 50% or 0.5mm of the pin width(W).(rejected)
5. Cylindrical end cap weldable end side migration:
Side excursion(A) not greater than 25% of the element diameter width(W) or pad width(P);(acceptable)
Side excursion(A) greater than 25% of element diameter width(W) or pad width(P).(rejected)
6. Chip component - rectangular or square solder end element lateral excursion:
Side excursion(A) is not greater than 50% of the width of solder end(W) of the element or 50% of the width of pad(P);(acceptable)
Side excursion(A) is greater than 50% of the width of solder end(W) of the element or 50% of the width of pad(P).(rejected)
7. Side excursion of j-shaped pin:
Side excursion(A) not exceeding 50% of pin width(W);(acceptable)
Side excursion(A) exceeding 50% of pin width(W).(rejected)
8. Tin connection:
The component pin and the pad are well welded without deviation short circuit.(acceptable)
Wire that should not be connected with solder joint;(rejected)
The solder forms a bridge between adjacent wires or components.(rejected)

Only strict implementation of acceptance procedures can guarantee the quality of SMT products.Only by paying more attention to quality can we survive in the increasingly competitive market.

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