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Quality Control Of Copper PCB
May 18, 2017

1. Strictly implement the first inspection system to ensure that the product size meets the design requirements;

2. According to the circuit board raw materials, reasonable choice milling process parameters;

3. Fixed the position of the circuit board, should carefully clamp, lest damage circuit board surface solder layer and solder resistance layer;

4. In ensuring the consistency of the substrate dimensions, the position accuracy must be strictly controlled;

5. In the disassembly, to pay special attention to the substrate when the base layer pad paper to avoid damage circuit board surface plating coating layer.