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Process Capability Of Copper PCB
May 18, 2017

(1) Drilling: Minimum aperture 0.15MM

(2) Hole metallization: Min aperture 0.15mm, plate thickness/aperture ratio of 4:1

(3) Conductor width: Minimum line width: Gold plate 0.075mm, tin plate 0.10mm

(4) Wire spacing: Minimum spacing: Gold plate 0.075mm, tin plate 0.10mm

(5) Gold plating PLATE: Nickel layer Thickness: > or = 2.5 μ Gold layer thickness: 0.05-0.1 μ m or according to customer requirements

(6) Spray tin Plate: tin layer Thickness: > or =2.5-5 μ

(7) Milling board: line to edge minimum distance: 0.15mm hole to edge min Distance: 0.2mm min Shape tolerance: ± 0.12mm

(8) Outlet chamfer: angles: 30 degrees, 45 degrees, 60 degrees depth: 1-3mm

(9) v Cut: angle: 30 degrees, 35 degrees, 45 degrees depth: thickness 2/3 min Size: 80mm * 80mm

(10) Pass-breaking test:

Solder Resistance: 85---105 ℃/280 ℃-360 ℃

Flex-resistance of flexible plates/chemical resistance: fully compliant with international standards