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China Printed Circuit Industry Transformation and Upgrade Plan (2016-2018) (Abstract)
Jul 27, 2017

First, the printed circuit board is an indispensable electronic components of the accessories, support the development of electronic equipment

Second, China is a large manufacturer of PCB, and high-end PCB products and foreign gap significantly

   (1) high-capacity multi-layer PCB to support the future of China's high growth of cloud computing and data communications high-speed high-frequency technology is not fully prepared

   (2) small and medium-sized PCB enterprise products can not meet the future of high-end portable electronic products, miniaturization of development needs

   (3) domestic high-frequency, high-power PCB technology is weak, unable to meet the smart car and new energy vehicles development needs

   (4) IC packaging board products as a whole by foreign monopoly, restricting the development of integrated circuit industry

   (5) national defense information, medical localization, industrial intelligence industry trends, high multi-layer rigid rigid plate has a strong demand, the market has great potential

   (6) the domestic high thermal conductivity of metal-based PCB, seriously restricting China's new energy, high-end power supply and automotive electronic systems and wireless communications system industry

   (7) domestic PCB enterprises in the intelligent factory and intelligent production is basically blank, seriously restricting the development of China's PCB industry.

   (8) equipment and raw and auxiliary materials supporting the lack of capacity, seriously restricting the development of China's PCB industry chain as a whole

Third, the future of PCB industry technology research direction

   (1) continue to increase in the development of next-generation communications for large-capacity high-speed high-frequency multi-layer board

   (2) focus on supporting embedded components, any layer interconnection HDI board, flexible FPC board development, to meet the development needs of high-end portable electronic products

   (3) continue to strengthen the high-frequency PCB products and high-power thick copper PCB product development, for the future development of the automotive industry to provide support

   (4) the continued development of high-density multi-layer packaging carrier technology to enhance China's integrated circuit and electronic packaging in the field of competitiveness

   (5) focus on strengthening the development of rigid and flexible combination of board, for the national defense information, medical localization, industrial intelligence industry development to provide supporting support

   (6) to strengthen the research and development of high thermal conductivity metal PCB board to enhance the competitiveness of China's new energy, high-end power supply and automotive electronic systems and wireless communication systems

   (7) focus on supporting China's PCB enterprises in accordance with the industrial 4.0 model, intelligent factory and intelligent production transformation and upgrading.

   (8) to break through the PCB production of key equipment and materials of domestic technology to enhance the PCB production equipment and raw and auxiliary materials supporting capacity

Fourth, the PCB industry policy needs the country in the technological transformation, industrial strong base, basic research and other aspects of the guidance of investment and support

   (1) to support the investment in technological transformation

   (2) to increase the support of industrial policy

   (3) to promote the deepening of basic research

   (4) to strengthen the construction of new PCB industry form