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A Thick Copper Surface Thickening Method For PCB
May 18, 2017

The invention discloses a thick copper plate copper surface thickening method, comprising the following processes: A. The use of the specification for 1-3OZ copper foil pressure synthesis with a thick copper substrate semi-finished products; B. Set the plating time, the thick copper PCB semi-finished level into the plating bath to thicken copper surface; When electroplating time reaches 1/2 of the set plating time, it flips the thick copper circuit board semi-finished products to continue plating. The invention uses the plating method to thicken copper surface and obtains the thick copper circuit board finished product, can produce thick copper circuit board efficiently and cheaply, solves the problems such as thick copper foil production shortage of raw materials, low production efficiency and poor quality of product.