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10 Layers HDI PCB Boards Manufacturers
Jul 11, 2017

Technical Capabilities

Max panel size1200mm x 600mm
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz
Outer copper thickness0.5~6 oz
Finished board thickness0.4-3.2 mm

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation
Layer count Capability1-30 LAYER
alignment between ML±2mil
Min drilling0.15 mm
Min finished hole0.1 mm
Hole precision±2 mil(±50 um)
tolerance for Slot±3 mil(±75 um)
tolerance for PTH±3 mil(±75um)
tolerance for NPTH±2mil(±50um)
Max Aspect Ratio for PTH8:1
Hole wall copper thickness15-50um
Alignment of outer layers4mil/4mil
Min trace width/space for outer layer4mil/4mil
Tolerance of Etching+/-10%
Thickness of solder maskon trace0.4-1.2mil(10-30um)
at trace corner≥0.2mil(5um)
On base material≤+1.2mil
  Finished thickness

Hardness of solder mask6H
Alignment of solder mask film±2mil(+/-50um)
Min width of solder mask bridge4mil(100um)
Max hole with solder plug0.5mm
Surface finishHASL (or LF), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger280u"(7um)
Max gold thickness for Gold finger30u"(0.75um)
Nickel thickness in Immersion Gold120u"/240u"(3um/6um)
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength≥61B/in(≥107g/mm)
bow and twist


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