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10 Layers TG170 2.0mm Heavy Copper Rigid FR4 PCB Board

10 Layers TG170 2.0mm Heavy Copper Rigid FR4 PCB Board
Specification:
Layer: 10layers
Board thickness:3.0+/-0.2mm
Copper thickness:3H/3H oz(inner layers)
Line/ space width: 4mil/4mil
Surface treatment: Immersion gold
Product Details:

Specification: 

Layer: 10layers
Board thickness:3.0+/-0.2mm
Copper thickness:3H/3H oz(inner layers)
Line/ space width: 4mil/4mil
Surface treatment: Immersion gold
Solder mask: Green
Rounting: CNC
Origin:China
Application: Super computer products.


FR4 Processing Capability

Item

Standard

Limitation

Material

CEM-1, CEM-3,FR4(halogen-free)

high frequency series

Layer

2 -- 12

16

Max size

580 * 620

580 *900

Finished Board Thickness(T)

0.4 - 3.5

0.3 - 5.4

0.4≤T≤0.8,tolerance +/-0.085

 

0.8≤T≤1.0,tolerance +/-0.1

 

T≤1.0mm,tolerance +/-10%

 

Copper Weight

0.5OZ -- 3OZ

5OZ

Warpage

0.75%(Max)

0.50%

1.2% (Max)

1.00%

Impedance Tolerance

natural impedance:+/-10%

natural impedance:+/-8%

differential impedance:+/-10%

differential impedance:+/-8%

Surface Treatment

LF HASL、ENIG、OSP、Immersion tin

Hybrid surface treatment

Line Width/
Line Space

≧0.5OZ,3mil/3mil

2.5mil/2.5mil

≧1OZ,5mil/5mil

4mil/4mil

≧2OZ,7mil/7mil

5mil/5mil

≧3OZ,9mil/9mil

8mil/8mil

≧4OZ,11mil/11mil

10mil/10mil

Min Hole Diameter

0.2mm

0.15mm

Max Hole Diameter

6.5mm

 

Hole Copper Thickness

12um -- 25um

Max 50um

Solder Mask

green, black, white, blue

yellow, coffee

S/M thickness

line/copper surface:12um-25um

10um-28um

line angle:5um-15um

10um-25um

base material position:18um-35um

35um-35um

Min S/M Bridge

base copper thickness≤H/Hoz,2.5mil

 

base copper thickness≤1/1oz,3.5mil

 

base copper thickness≤2/2oz,1mil

 

base copper thickness≤3/3oz,5.0mil

 

Legend

min width:10mil

 

Min height:30mil

 

min legend s/m bridge:6mil

 

碳油

min width 14mil

12mil

LF HASL Thickess

0.8um-40um

2.5um-40um

ENIG Thickness

nickel thickness:2.54um≤max≤5um

 

gold thickness:0.025um≤max≤0.05um

 

V-cut slot

board thickness:0.4mm≤max≤3.0mm

0.2mm≤max≤5.0mm

Package

EPE foam &vacuum packing

vacuum package bags

PS

Please send drawing files or call us for other special request.


We provide one-stop electronic manufacturing service from PCB design, prototype, production to PCBA assembly, FR4 PCBproducts include Blind/ buried via, Impedance control, High TG, halogen free,1-16layers.
All the PCBs are authorized by ISO 9001,ISO14001, TS16949, UL and RoHS Directive-compliant certified.
PCB production equipments: machining center, CNC engraving milling machine, CNC, lathe machine, millingmachine, punching machine, CNC milling machines, centerless grinding, and many other precision equipment.
Four high speed automatic SMT lines for PCBA assemblyequipments: Fuji machines, AOI, SPI, X-RAY, and BGA rework facilities.
QC system: 100% inspection before shipment.


图片26.jpg


Generally L/T:
2L: 6~8days, sample:3days;
4L-6L: 10~12days, sample:5~7days;
8-10L: 12~14days, sample:8~9days;
12-16L: 16~18days, sample:10~12days


Please contact usfreely for any PCB or PCBA issues:
Shenzhen Aibixing Industrial Co.,Ltd
sales@abxing-pcb.com
Skype: abxing.pcb
Website:www.abxing-pcb.com

We are one of the leading China manufacturers focusing on 8-10 Layers PCB fabrication. If you are interested in our 10 layers tg170 2.0mm heavy copper rigid fr4 pcb board, welcome to contact our factory. We're sure to offer you the best quality products on time and excellent one-stop service.

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