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10 Layers TG170 2.0mm Heavy Copper Rigid FR4 PCB Board
Layer: 10layers
Board thickness:3.0+/-0.2mm
Copper thickness:3H/3H oz(inner layers)
Line/ space width: 4mil/4mil
Surface treatment: Immersion gold
Specification:
Layer: 10layers
Board thickness:3.0+/-0.2mm
Copper thickness:3H/3H oz(inner layers)
Line/ space width: 4mil/4mil
Surface treatment: Immersion gold
Solder mask: Green
Rounting: CNC
Origin:China
Application: Super computer products.
FR4 Processing Capability | ||
Item | Standard | Limitation |
Material | CEM-1, CEM-3,FR4（halogen-free） | high frequency series |
Layer | 2 -- 12 | 16 |
Max size | 580 * 620 | 580 *900 |
Finished Board Thickness(T) | 0.4 - 3.5 | 0.3 - 5.4 |
0.4≤T≤0.8,tolerance +/-0.085 |
| |
0.8≤T≤1.0,tolerance +/-0.1 |
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T≤1.0mm,tolerance +/-10% |
| |
Copper Weight | 0.5OZ -- 3OZ | 5OZ |
Warpage | 0.75%（Max） | 0.50% |
1.2% (Max) | 1.00% | |
Impedance Tolerance | natural impedance：+/-10% | natural impedance：+/-8% |
differential impedance：+/-10% | differential impedance：+/-8% | |
Surface Treatment | LF HASL、ENIG、OSP、Immersion tin | Hybrid surface treatment |
Line Width/ | ≧0.5OZ，3mil/3mil | 2.5mil/2.5mil |
≧1OZ，5mil/5mil | 4mil/4mil | |
≧2OZ，7mil/7mil | 5mil/5mil | |
≧3OZ，9mil/9mil | 8mil/8mil | |
≧4OZ，11mil/11mil | 10mil/10mil | |
Min Hole Diameter | 0.2mm | 0.15mm |
Max Hole Diameter | 6.5mm |
|
Hole Copper Thickness | 12um -- 25um | Max 50um |
Solder Mask | green, black, white, blue | yellow, coffee |
S/M thickness | line/copper surface：12um-25um | 10um-28um |
line angle：5um-15um | 10um-25um | |
base material position：18um-35um | 35um-35um | |
Min S/M Bridge | base copper thickness≤H/Hoz，2.5mil |
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base copper thickness≤1/1oz，3.5mil |
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base copper thickness≤2/2oz，1mil |
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base copper thickness≤3/3oz，5.0mil |
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Legend | min width：10mil |
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Min height：30mil |
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min legend s/m bridge：6mil |
| |
碳油 | min width 14mil | 12mil |
LF HASL Thickess | 0.8um-40um | 2.5um-40um |
ENIG Thickness | nickel thickness：2.54um≤max≤5um |
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gold thickness：0.025um≤max≤0.05um |
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V-cut slot | board thickness：0.4mm≤max≤3.0mm | 0.2mm≤max≤5.0mm |
Package | EPE foam &vacuum packing | vacuum package bags |
PS | Please send drawing files or call us for other special request. | |
We provide one-stop electronic manufacturing service from PCB design, prototype, production to PCBA assembly, FR4 PCBproducts include Blind/ buried via, Impedance control, High TG, halogen free,1-16layers.
All the PCBs are authorized by ISO 9001,ISO14001, TS16949, UL and RoHS Directive-compliant certified.
PCB production equipments: machining center, CNC engraving milling machine, CNC, lathe machine, millingmachine, punching machine, CNC milling machines, centerless grinding, and many other precision equipment.
Four high speed automatic SMT lines for PCBA assemblyequipments: Fuji machines, AOI, SPI, X-RAY, and BGA rework facilities.
QC system: 100% inspection before shipment.
Generally L/T:
2L: 6~8days, sample:3days;
4L-6L: 10~12days, sample:5~7days;
8-10L: 12~14days, sample:8~9days;
12-16L: 16~18days, sample:10~12days
Please contact usfreely for any PCB or PCBA issues:
Shenzhen Aibixing Industrial Co.,Ltd
sales@abxing-pcb.com
Skype: abxing.pcb
Website:www.abxing-pcb.com
We are one of the leading China manufacturers focusing on 8-10 Layers PCB fabrication. If you are interested in our 10 layers tg170 2.0mm heavy copper rigid fr4 pcb board, welcome to contact our factory. We're sure to offer you the best quality products on time and excellent one-stop service.
