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10 Layer PCB High Density Custom PCB Board

Application: Consumer Electronics Layer: 10 Special Processing: Impedance Control Material: FR4 Outer Track W/S: 4/4mil Inner Track W/S: 5/3.5mil Board Thickness: 2.0mm Min. Hole Diameter: 0.25mm
Product Details:


Application: Consumer Electronics

Layer: 10

Special Processing: Impedance Control

Material: FR4

Outer Track W/S: 4/4mil

Inner Track W/S: 5/3.5mil

Board Thickness: 2.0mm

Min. Hole Diameter: 0.25mm


Custom pcb board circuit layout technique


5. Component layout principle:

A, general principle: in the PCB design, if circuit system exists artificial, digital circuit and big current circuit in the same time, you must separate layout, to minimize the coupling between each system, and in the same type circuit, place component according to the signal flow direction and block function.

B. Input signal processing unit. The drive element of output signal should be near the custom pcb board edge to make input and output signal line as short as possible,in order to reduce the input and output interference.

C. The element direction when is placed: the elements can only be placed in two directions along the horizontal and vertical direction. Otherwise, it must not be suit for plug-in.

D. Element spacing. for medium density custom pcb board, such as small components, small power resistor, capacitor and diode, the space of each other is related with plug-ins and welding technology. For wave soldering, the element spacing can take 50-100 mil(1.27-2.54mm), it can be larger when manual mouting, such as when 100mil,the components spacing is usually 100-150mil for integrated circuit chip.

E. When the potential difference between components is large, the components spacing should be large enough to prevent discharge.

F. IC decoupled capacitive should be closed to power ground pins of the chip.  Otherwise filtering effect will be worse. In digital circuit, in order to ensure the reliable work for digital circuit system, place IC coupling capacitance between power supply and ground in every digital integrated circuit chip. Generally use ceramics capacitors, capacity of 0.01~0.1UF, capacity selection is based on the reciprocal of system working frequency F. In addition, at the entrance of the power supply circuit of the power wire and ground line,a 10UF capacitor and a 0.01UF porcelain capacitor are required.

The clockwise circuit elements are as close to the pins of clock signal chip as possible to reduce the wire length of the clock circuit.And there should be no lines under the chip.


We are one of the leading China manufacturers focusing on 8-10 Layers PCB fabrication. If you are interested in our 10 Layer PCB High Density Custom PCB Board, welcome to contact our factory. We're sure to offer you the best quality products on time and excellent one-stop service.
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